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Request a Quote on Chomerics (Parker) Part Number 50-02-1038-0000 to Meet Your Adhesives And Coating Needs

Mfg Part Number : 50-02-1038-0000
Manufacturer : Chomerics (Parker)
Main Category : Adhesives And Coating
Category : Lubricants, Adhesives, And Coatings
Sub Category : Adhesives, Epoxy, And Resins
Description : Cho-Bond 1038 Silver-Plated Copper Filled Silicone Electrically Conductive Sealant. Parker Chomerics Cho Bond® 1038 Is A One Component, Silver-Plated Copper Filled Sealant Formulated To Serve As Gap Filler For Emi Shielding Or Electrical Grounding.

For customers seeking a reliable Adhesives And Coating parts distributor, Broadline Electromechanicals is an optimal solution with over 2 billion items that are readily available at any time. We thank you for taking an interest in part number 50-02-1038-0000, a Chomerics (Parker) product we have in stock that is listed alongside the description “Cho-Bond 1038 Silver-Plated Copper Filled Silicone Electrically Conductive Sealant. Parker Chomerics Cho Bond® 1038 Is A One Component, Silver-Plated Copper Filled Sealant Formulated To Serve As Gap Filler For Emi Shielding Or Electrical Grounding.”. When you are ready to begin the purchasing process for part number 50-02-1038-0000, we provide online RFQ forms to fill out and submit for the means of receiving a competitive quote for your comparisons.

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Disclaimer: This is a quotation for the goods listed above. This quotation is meant as an estimate and does not reflect a final bill or invoice. All quotations are subject to change until acceptance by ASAP Semiconductor of a binding Purchase Order, and quotations may be withdrawn or revised at the sole discretion of ASAP Semiconductor. This quotation is subject to the ASAP Semiconductor Terms & Conditions available at https://www.asapsemi.com/terms-conditions.aspx . All United States Government and Department of Defense bids are quoted as CAGE code 6RE77 from ASAP Semiconductor’s Anaheim, California facility. Any quotation from ASAP Semiconductor without 6RE77 is void.

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With AS9120B, ISO 9001:2015, and FAA AC 00-56B accreditation, we regularly go above and beyond industry expectations to bring customers the best Chomerics (Parker) products on the market with every purchase. Additionally, we are fully committed to alleviating diverse time constraints, offering expedited shipping speeds on countless Lubricants, Adhesives, And Coatings items for domestic and international orders alike. We are also experts in tracking down electromechanical parts with long lead times, unearthing solutions when alternative channels come up short. With such commitments in mind, kick off procurement for part number 50-02-1038-0000 and other Cho-Bond 1038 Silver-Plated Copper Filled Silicone Electrically Conductive Sealant. Parker Chomerics Cho Bond® 1038 Is A One Component, Silver-Plated Copper Filled Sealant Formulated To Serve As Gap Filler For Emi Shielding Or Electrical Grounding. products today.

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